In stock
OH Content: <1 ppm
Polishing compound: no metallic particles
S1 Flatness, PV IR S2 Flatness, PV: λ/5 @ 632.8nm
S1 Flatness, PV IR S2 Flatness, PV: λ/8 @ 632.8nm (after coating)
Surface quality, S-D: 10 – 5
Surface quality, S-D: 10 – 5 (after coating, MIL standard)
Metallic Imp: <100 ppb
Wedge, arcmin: <3
Index Homogeneity: Grade C-E
Configuration: Corning 7979 (IR Grade fused silica)
Chips, mm: <0.1
LIDT: 100kW/cm2 CW @1080 target (theoretical) threshold
Inclusion: Class 0
Dimensions, mm: according to the drawing alt_endcap20C_00
Coating:
Clear Aperture: >90 (overspray possibility on the side surfaces)
Clear Aperture: >90
Absorption: < 10 ppm/surface
Material:
Polishing compound: no metallic particles
S1 Flatness, PV IR S2 Flatness, PV: λ/5 @ 632.8nm
S1 Flatness, PV IR S2 Flatness, PV: λ/8 @ 632.8nm (after coating)
Surface quality, S-D: 10 – 5
Surface quality, S-D: 10 – 5 (after coating, MIL standard)
Metallic Imp: <100 ppb
Wedge, arcmin: <3
Index Homogeneity: Grade C-E
Configuration: Corning 7979 (IR Grade fused silica)
Chips, mm: <0.1
LIDT: 100kW/cm2 CW @1080 target (theoretical) threshold
Inclusion: Class 0
Dimensions, mm: according to the drawing alt_endcap20C_00
Coating:
Clear Aperture: >90 (overspray possibility on the side surfaces)
Clear Aperture: >90
Absorption: < 10 ppm/surface
Material:
