In stock
LIDT: 15 J/cm^2, 1064 nm, 10 ns, 50 Hz
S1: PR(Rp=99.985% +/-0.01%, GDDp<20fs^2)@ 1064 nm, AOI=45 deg, electric field optimized
Thickness, mm: 6.35
Thickness tolerance, mm: ±0.1
S2 Surface quality, S-D: 10-5 S-D
S1 Surface quality, S-D: 10-5 S-D
Substrate: 1-OS-2-0254-635-P
S2: uncoated
Wedge/parallelism error: <5 arcsec
S2 Flatness, PV: <λ/10 @ 632.8 nm per CA
Clear aperture: >90%
Overall transmission: Tp=0.025% +/-0.01% @ 1064 nm, AOI=45 deg
Chips, mm: <0.3
S1 Transmitted wavefront distortion, TWD: <λ/10 @ 632.8 nm per CA
Coatings:
Dimension tolerance, mm: +0/-0.1
Dimensions, mm: Ø25.4
Material: UVFS (Corning 7980 0F)
Protective chamfers: 0.1-0.25 mm x 45°
S1 Flatness, PV: <λ/10 @ 632.8 nm per CA
S1: PR(Rp=99.985% +/-0.01%, GDDp<20fs^2)@ 1064 nm, AOI=45 deg, electric field optimized
Thickness, mm: 6.35
Thickness tolerance, mm: ±0.1
S2 Surface quality, S-D: 10-5 S-D
S1 Surface quality, S-D: 10-5 S-D
Substrate: 1-OS-2-0254-635-P
S2: uncoated
Wedge/parallelism error: <5 arcsec
S2 Flatness, PV: <λ/10 @ 632.8 nm per CA
Clear aperture: >90%
Overall transmission: Tp=0.025% +/-0.01% @ 1064 nm, AOI=45 deg
Chips, mm: <0.3
S1 Transmitted wavefront distortion, TWD: <λ/10 @ 632.8 nm per CA
Coatings:
Dimension tolerance, mm: +0/-0.1
Dimensions, mm: Ø25.4
Material: UVFS (Corning 7980 0F)
Protective chamfers: 0.1-0.25 mm x 45°
S1 Flatness, PV: <λ/10 @ 632.8 nm per CA
