In stock
Chips: <0.1 mm
Clear aperture: >90 %
Coatings:
Dimensions A x B x C, mm: 7 mm x 6 mm (+0/-0.1 mm)
LIDT: >1 J/cm^2 at 1 ns, 266 nm, >5 J/cm^2 at 1 ns, 532 nm
Material: CaF2 (free of laser induced fluorescence at 266 nm)
Protective chamfers: 0.1 – 0.2 mm x 45 deg
S1(wedge, arrow marks): HRs>99.5%@ 532 nm + HTp>90%@ 266 nm, AOI=45 deg
S2(): ARp<0.3%@ 266 nm, AOI=45 deg
S1 Flatness, PV IR S2 Flatness, PV: λ/2@ 633 nm
Surface quality, S1/S2: 20-10 S-D
Thickness (at thin edge): 1 mm (+/-0.1 mm)
Wedge / Parallelism error: 0.2 deg +/-0.1 deg (along 7 mm)
Clear aperture: >90 %
Coatings:
Dimensions A x B x C, mm: 7 mm x 6 mm (+0/-0.1 mm)
LIDT: >1 J/cm^2 at 1 ns, 266 nm, >5 J/cm^2 at 1 ns, 532 nm
Material: CaF2 (free of laser induced fluorescence at 266 nm)
Protective chamfers: 0.1 – 0.2 mm x 45 deg
S1(wedge, arrow marks): HRs>99.5%@ 532 nm + HTp>90%@ 266 nm, AOI=45 deg
S2(): ARp<0.3%@ 266 nm, AOI=45 deg
S1 Flatness, PV IR S2 Flatness, PV: λ/2@ 633 nm
Surface quality, S1/S2: 20-10 S-D
Thickness (at thin edge): 1 mm (+/-0.1 mm)
Wedge / Parallelism error: 0.2 deg +/-0.1 deg (along 7 mm)
